STPS8H100DEE View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS8H100DEE Datasheet PDF : 8 Pages
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Characteristics
STPS8H100DEE
Figure 7. Forward voltage drop versus
forward current
Figure 8.
Thermal resistance junction to
ambient versus copper surface
under tab
IFM(A)
100.0
Tj=125 °C
(Maximum values)
Rth(j-a)(°C/W)
250
epoxy printed board FR4, copper thickness=35µm
200
PowerFLAT (3.3x3.3)
10.0
1.0
Tj=125 °C
(Typical values)
Tj=25 °C
(Maximum values)
150
100
50
VFM(V)
SCu(cm²)
0.1
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
1
2
3
4
5
6
7
8
9
10
4/8
Doc ID 023272 Rev 1
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