S06 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
S06 Datasheet PDF : 10 Pages
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STTH3L06
Figure 7: Softness factor versus dIF/dt (typical
values)
S factor
2.0
1.8
IF=IF(AV)
VR=400V
Tj=125°C
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
dIF/dt(A/µs)
20
40
60
80 100 120 140 160 180 200
Figure 9: Transient peak forward voltage
versus dIF/dt (typical values)
VFP(V)
10
9
IF=IF(AV)
Tj=125°C
8
7
6
5
4
3
2
1
dIF/dt(A/µs)
0
0
20
40
60
80 100 120 140 160 180 200
Figure 8: Relative variations of dynamic
parameters versus junction temperature
1.25
1.00
0.75
0.50
0.25
0.00
25
S factor
IRM
QRR
Tj(°C)
IF=IF(AV)
VR=400V
Reference: Tj=125°C
50
75
100
125
Figure 10: Forward recovery time versus dIF/dt
(typical values)
tfr(ns)
200
180
160
IF=IF(AV)
VFR=1.1 x VF max.
Tj=125°C
140
120
100
80
60
40
20
0
0
20
40
dIF/dt(A/µs)
60
80
100 120 140 160 180 200
Figure 11: Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
10
VR(V)
1
1
10
100
1000
Figure 12: Thermal resistance junction to
ambient versus copper surface under lead
(epoxy FR4, eCU=35µm) (DO-201AD)
Rth(j-a)(°C/W)
80
70
60
DO-201AD
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/10
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