S06 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
S06 Datasheet PDF : 10 Pages
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STTH3L06
Figure 13: Thermal resistance junction to
ambient versus copper surface under lead
(epoxy FR4, eCU=35µm) (SMB / SMC)
Rth(j-a)(°C/W)
100
90
80
SMB
70
60
SMC
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 14: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy FR4, eCU=35µm) (DPAK)
Rth(j-a)(°C/W)
100
90
80
70
60
50
DPAK
40
30
20
10
0
0
SCU(cm²)
5
10
15
20
25
30
35
40
Figure 15: Thermal resistance versus lead length
Rth(°C/W)
100
90
80
70
60
50
40
30
20
10
0
5
10
Rth(j-a)
Rth(j-l)
Llead(mm)
15
DO-201AD
20
25
5/10
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