CS48500 View Datasheet(PDF) - Cirrus Logic
Part Name
Description
Manufacturer
CS48500 Datasheet PDF : 28 Pages
| |||
CS48500 Data Sheet
32-bit Audio Decoder DSP Family
5.4 Power Supply Characteristics
(measurements performed under operating conditions)
Parameter
Operational Power Supply Current:
VDD: Core and I/O operating1
VDDA: PLL operating
VDDIO: With most ports operating
Total Operational Power Dissipation:
Min
Typ
Max
Unit
-
203
-
mA
-
8
-
mA
-
27
-
mA
469
mW
Standby Power Supply Current:
VDD: Core and I/O not clocked
VDDA: PLL halted
VDDIO: All connected I/O pins 3-stated by other ICs in system
T Total Standby Power Dissipation:
F 1.Dependent on application firmware and DSP clock speed.
-
100
-
µA
-
1
-
µA
-
15
-
µA
-
350
-
µW
A 5.5 Thermal Data (48 LQFP)
R Parameter
Symbol Min
Thermal Resistance (Junction to Ambient)
D Two-layer Board1 θja
-
Four-layer Board2
-
Thermal Resistance (Junction to Top of Package)
L I Two-layer Board1 ψjt
-
IA Four-layer Board2
-
Typ
63.5
54
0.70
0.64
Max
Unit
-
°C / Watt
-
-
°C / Watt
-
H Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper
T P covering 20 % of the top & bottom layers.
2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper
N L covering 20 % of the top & bottom layers and 0.5-oz. copper covering 90 % of the internal power plane
& ground plane layers.
E E 3. To calculate the die temperature for a given power dissipation
ID D Τj = Ambient Temperature + [ (Power Dissipation in Watts) * θja ]
4. To calculate the case temperature for a given power dissipation
CONF Τc = Τj - [ (Power Dissipation in Watts) * ψ jt ]
DS734A3
©Copyright 2006 Cirrus Logic, Inc.
13
CONFIDENTIAL
Share Link: 