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STM32F217REH6V View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STM32F217REH6V Datasheet PDF : 173 Pages
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Electrical characteristics
STM32F21xxx
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 50 or Figure 51,
depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 50. Power supply and reference decoupling (VREF+ not connected to VDDA)
STM32F
V REF+
(See note 1)
1 µF // 10 nF
1 µF // 10 nF
V DDA
V SSA/V REF-
(See note 1)
ai17535
1. VREF+ and VREF– inputs are both available on UFBGA176 package. VREF+ is also available on all packages
except for LQFP64. When VREF+ and VREF– are not available, they are internally connected to VDDA and
VSSA.
Figure 51. Power supply and reference decoupling (VREF+ connected to VDDA)
STM32F
VREF+/VDDA
(See note 1)
1 µF // 10 nF
VREF–/VSSA
(See note 1)
ai17536
1. VREF+ and VREF– inputs are both available on UFBGA176 package. VREF+ is also available on all packages
except for LQFP64. When VREF+ and VREF– are not available, they are internally connected to VDDA and
VSSA.
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Doc ID 17050 Rev 8

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