FBFM2112F897CSLJLS View Datasheet(PDF) - Intel

Part Name

Description

Manufacturer

FBFM2112F897CSLJLS

Intel® FM2112 24-Port 10G/1G Ethernet Switch Chip

Intel 

Intel® FM2112 24-Port 10G/1G Ethernet Switch Chip Data Sheet

Notes:

6.6

6.6.1

Table 190. Dimensions Used in Figures

Dimensional References

Reference

A

A1

A2

D

D1

E

E1

e

M

N

Ref.: JEDEC MS-034 B

Min

2.67

0.39

2.18

31.80

31.80

Nom

3.07

0.49

2.58

32.00

30.0 BSC

32.00

30.0 BSC

1.00 BSC

31

897

Max

3.47

0.59

2.98

32.20

32.20

1. All dimensions are in millimeters.

2. “e” represents the basic solder ball grid pitch.

3. “M” represents the basic solder ball matrix size, and symbol “N” is the maximum

allowable number of balls after depopulating.

4. Primary datum C and Seating Plane are defined by the spherical crowns of the solder

balls.

5. Package surface is Ni plated.

6. Black spot (or circular etch) for pin 1 identification.

7. Dimensioning and tolerancing per ASME Y14.5M 1994

Power Dissipation and Heat Sinking

Power Dissipation

The power dissipation of the FM2112 is dependent on a number of

different operational factors including:

• The number of ports in operation

• The operating rate of each port (10 Gbps, 2.5 Gbps, 1.0 Gbps, etc)

• The utilization factor of each port (the percentage of the bit stream that is actual

data, vs. 8B/10B idle characters)

• The distribution of frame sizes

• SerDes drive strengths

• Use of the CPU interface

• Supply voltages

• Temperature

159

Share Link: