FBFM2112F897CSLJLS View Datasheet(PDF) - Intel

Part Name

Description

Manufacturer

FBFM2112F897CSLJLS

Intel® FM2112 24-Port 10G/1G Ethernet Switch Chip

Intel 

Intel® FM2112 24-Port 10G/1G Ethernet Switch Chip Data Sheet

Notes:

6.6.2

Though the dependencies above have a considerable effect on supply

current draws and overall power dissipation, useful guidelines can be

provided through measured data under two operating conditions. One

condition consists of the most aggressive possible values for the

parameters that have the most impact, namely utilization percentage

and frame size. Other parameters such as SerDes drive strength,

supply voltages and case temperatures are kept at nominal values.

Values under a second, more typical use model assume more moderate

values for frame sizes and utilization percentages, while keeping the

other parameters at their nominal values. The test conditions and

resulting current draws and overall power dissipation values are shown

in Table 191 and Table 192.

Table 191. Conditions for Power Measurements

Parameter

Operating ports

Operating rate of ports

Utilization factor

Frame size

SerDes drive parameters

CPU utilization

Supply voltages

Temperature, case

Frame handler clock

Aggressive Case

24

8x10G, 16x1G

100%

64B

Nominal

Not in use

Nominal

~60ºC

200 MHz

Typical

24

8x10G, 16x1G

50%

256B

Nominal

Not in use

Nominal

~60ºC

200 MHz

Table 192. FM2112 Currents and Power

Power Supply Currents (A)

Typical Use

Most Aggressive

IDD

(VDD=1.2V)

7.8

11.3

IDDX

(VDDX=1.0V)

3.0

3.0

ITT

(VTT=1.5V)

1.3

1.3

Total Power (W)

14,3

18.5

(1) IDDA is approximately 10 mA per port and is measured as a part of IDDX.

(2) VDDA33 is approximately 4 mA

(3) VDD33 is used for the CPU interface and no current is drawn when not in use.

(p4a)raUmsientgerVsD. DX = 1.2V will raise power dissipations by up to 2W, depending on use

Heat Sinking

It is anticipated that a heat sink will be required for most FM2112

applications. The goal of heat sink design is to keep the operating case

temperature of the device below its maximum allowed value. This will

also ensure that the junction stays below its maximum allowable

160

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