ADP1752ACPZ-0.75R7 View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADP1752ACPZ-0.75R7

0.8 A, Low VIN, Low Dropout Linear Regulator

Analog Devices 

Data Sheet

In cases where the board temperature is known, the thermal

characterization parameter, ΨJB, can be used to estimate the

junction temperature rise. Maximum junction temperature (TJ)

is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(7)

Figure 42 through Figure 45 show junction temperature calcula-

tions for different board temperatures, load currents, VIN to

VOUT differentials, and areas of PCB copper.

140

MAX JUNCTION

TEMPERATURE

120

100

LOAD = 800mA

80

60

LOAD = 400mA

LOAD = 200mA

40

20

LOAD = 100mA

LOAD = 50mA

LOAD = 10mA

0

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 42. 500 mm2 of PCB Copper, TB = 25°C, LFCSP

140

MAX JUNCTION

TEMPERATURE

120

LOAD = 800mA

100

LOAD = 400mA

80

LOAD = 200mA

60

40

LOAD = 100mA

LOAD = 50mA

LOAD = 10mA

20

0

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 43. 500 mm2 of PCB Copper, TB = 50°C, LFCSP

ADP1752/ADP1753

140

MAX JUNCTION

TEMPERATURE

120

100

LOAD = 800mA

80

LOAD = 400mA

60

LOAD = 200mA

40

20

LOAD = 100mA

LOAD = 50mA

0

LOAD = 10mA

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 44. 1000 mm2 of PCB Copper, TB = 25°C, LFCSP

140

MAX JUNCTION

TEMPERATURE

120

LOAD = 800mA

100

80

LOAD = 400mA

LOAD = 200mA

60

40

LOAD = 100mA

LOAD = 50mA

LOAD = 10mA

20

0

0.25

0.75

1.25

1.75

2.25

2.75

VIN – VOUT (V)

Figure 45. 1000 mm2 of PCB Copper, TB = 50°C, LFCSP

Rev. E | Page 17 of 20

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