STM32F051X8 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F051X8

STMicroelectronics

STM32F051X8 Datasheet PDF : 122 Pages

First Prev 111 112 113 114 115 116 117 118 119 120 Next Last

Package information

STM32F051x4 STM32F051x6 STM32F051x8

7.8

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 20: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 74. Package thermal characteristics

Symbol

Parameter