PIC16F1503-IST View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F1503-IST

14-Pin Flash, 8-Bit Microcontrollers

Microchip Technology 

PIC16(L)F1503

TABLE 28-5: MEMORY PROGRAMMING SPECIFICATIONS

Standard Operating Conditions (unless otherwise stated)

Param.

No.

Sym.

Characteristic

Min. Typ† Max. Units

Conditions

Program Memory

Programming Specifications

D110 VIHH Voltage on MCLR/VPP pin

8.0

—

9.0

V (Note 2)

D112 VPBE VDD for Bulk Erase

2.7

— VDDMAX V

D113 VPEW VDD for Write or Row Erase

VDDMIN

—

VDDMAX V

D114

IPPPGM Current on MCLR/VPP during

Erase/Write

—

1.0

—

mA

D115

IDDPGM Current on VDD during

Erase/Write

—

5.0

—

mA

D121 EP

Program Flash Memory

Cell Endurance

D122

D123

D124

VPRW

TIW

TRETD

VDD for Read/Write

Self-timed Write Cycle Time

Characteristic Retention

10K

—

—

E/W -40C  TA  +85C

(Note 1)

VDDMIN

—

VDDMAX V

—

2

2.5

ms

—

40

—

Year Provided no other

specifications are violated

D125 EHEFC High-Endurance Flash Cell

100K

—

—

E/W 0C  TA  +60°C, lower

byte last 128 addresses

†

Note 1:

2:

Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Self-write and Block Erase.

Required only if single-supply programming is disabled.

TABLE 28-6: THERMAL CONSIDERATIONS

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

TH02

JA Thermal Resistance Junction to Ambient

70

95.3

100

55.3

52.3

JC Thermal Resistance Junction to Case

32.75

C/W

C/W

C/W

C/W

C/W

C/W

31

C/W

24.4

C/W

10

C/W

11

C/W

TH03

TJMAX Maximum Junction Temperature

150

C

TH04

PD Power Dissipation

—

W

TH05 PINTERNAL Internal Power Dissipation

—

W

TH06

PI/O I/O Power Dissipation

—

W

TH07

PDER Derated Power

—

W

Note 1:IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature.

3: TJ = Junction Temperature.

14-pin PDIP package

14-pin SOIC package

14-pin TSSOP package

16-pin QFN 3X3X0.9mm package

16-pin UQFN 3X3X0.5mm package

14-pin PDIP package

14-pin SOIC package

14-pin TSSOP package

16-pin QFN 3X3X0.9mm package

16-pin UQFN 3X3X0.5mm package

PD = PINTERNAL + PI/O

PINTERNAL = IDD x VDD(1)

PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))

PDER = PDMAX (TJ - TA)/JA(2)

 2011-2015 Microchip Technology Inc.

DS40001607D-page 275

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