ESDA18-1F2(2005) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ESDA18-1F2
(Rev.:2005)

TRANSIL™: Transient Voltage Suppressor

STMicroelectronics 

Figure 10: Ordering Information Scheme

ESD Array

Breakdown Voltage

18 = 18 Volts max.

ESDA18-1F2

ESDA 18 - 1 Fx

Number of line

1 = signle line

Package

F = Flip-Chip

x = 2: Leadfree Pitch = 500µm, Bump = 315µm

Figure 11: FLIP-CHIP Package Mechanical Data

500µm ± 50

315µm ± 50

650µm ± 65

0.95mm ± 50µm

Figure 12: Foot Print Recommendations

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 315µm copper pad diameter

Figure 13: Marking

Dot, ST logo

xx = marking

z = packaging location

yww = datecode

(y = year

ww = week)

All dimensions in µm

365

240

E

xxz

y ww

5/7

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