STM8S207C8T3TR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM8S207C8T3TR

Performance line, 24 MHz STM8S 8-bit MCU, up to 128 KB Flash, integrated EEPROM, 10-bit ADC, timers, 2 UARTs, SPI, I²C, CAN

STMicroelectronics 

STM8S207xx, STM8S208xx

Package characteristics

11.2

11.2.1

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 18: General operating conditions on page 55.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

● TAmax is the maximum ambient temperature in ° C

● ΘJA is the package junction-to-ambient thermal resistance in ° C/W

● PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

● PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

● PI/Omax represents the maximum power dissipation on output pins, where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), and taking account of the actual VOL/IOL and

VOH/IOH of the I/Os at low and high level in the application.

Table 57. Thermal characteristics(1)

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

LQFP 80 - 14 x 14 mm

38

ΘJA

Thermal resistance junction-ambient

LQFP 64 - 14 x 14 mm

45

ΘJA

Thermal resistance junction-ambient

LQFP 64 - 10 x 10 mm

46

ΘJA

Thermal resistance junction-ambient

LQFP 48 - 7 x 7 mm

57

ΘJA

Thermal resistance junction-ambient

LQFP 44 - 10 x 10 mm

54

ΘJA

Thermal resistance junction-ambient

LQFP 32 - 7 x 7 mm

60

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

Doc ID 14733 Rev 12

95/103

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