STPS15L25D View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS15L25D Datasheet PDF : 5 Pages
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Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).
STPS15L25D/G
Fig. 6: Relative variation of thermal impedance
junction to case versus pulse duration.
IM(A)
350
300
250
200
150
100
IM
50
t
δ=0.5
0
1E-3
t(s)
1E-2
1E-1
Tc=25°C
Tc=75°C
Tc=100°C
1E+0
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6 δ = 0.5
0.4
δ = 0.2
0.2 δ = 0.1
0.0
1.0E-4
Single pulse
1.0E-3
t(s)
1.0E-2
T
δ=tp/T
1.0E-1
tp
1.0E+0
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
IR(mA)
1E+3
1E+2
Tj=150°C
Tj=125°C
C(nF)
5.0
1E+1
1.0
1E+0
1E-1
Tj=25°C
VR(V)
1E-2
0.1
0
5
10
15
20
25
1
2
F=1MHz
Tj=25°C
VR(V)
5
10
20 30
Fig. 9: Forward voltage drop versus forward
current (maximum values).
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 µm).
(STPS15L25G only)
IFM(A)
200.0
100.0
Typical values
Tj=150°C
10.0
Tj=125°C
Tj=25°C
1.0
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm²)
0
0 4 8 12 16 20 24 28 32 36 40
3/5
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