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DSPIC33FJ32MC304-I/SP View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
DSPIC33FJ32MC304-I/SP Datasheet PDF : 460 Pages
First Prev 411 412 413 414 415 416 417 418 419 420 Next Last
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
32.1 High Temperature DC Characteristics
TABLE 32-1: OPERATING MIPS VS. VOLTAGE
Max MIPS
Characteristic
VDD Range
(in Volts)
Temperature Range
(in °C)
dsPIC33FJ32MC302/304,
dsPIC33FJ64MCX02/X04 and
dsPIC33FJ128MCX02/X04
3.0V to 3.6V(1)
-40°C to +150°C
20
Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized.
TABLE 32-2: THERMAL OPERATING CONDITIONS
Rating
High Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD - Σ IOH)
I/O Pin Power Dissipation:
I/O = Σ ({VDD - VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
+155
°C
TA
-40
+150
°C
PD
PINT + PI/O
W
PDMAX
(TJ - TA)/θJA
W
TABLE 32-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C TA +150°C for High Temperature
Parameter
No.
Symbol
Characteristic
Min
Typ
Max Units
Conditions
Operating Voltage
HDC10 Supply Voltage
VDD
3.0
3.3
3.6
V -40°C to +150°C
Note 1: Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized.
DS70291G-page 414
© 2007-2012 Microchip Technology Inc.

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