STM32L152RCY7 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STM32L152RCY7
STMicroelectronics
STM32L152RCY7 Datasheet PDF : 136 Pages
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Electrical characteristics
STM32L151xC STM32L152xC
Figure 30. Maximum dynamic current consumption on VREF+ supply pin during ADC
conversion
Sampling (n cycles)
ADC clock
Iref+
700µA
300µA
Conversion (12 cycles)
MS36686V1
Table 58. Maximum source impedance RAIN max(1)
RAIN max (kΩ)
Ts
(µs)
Multiplexed channels
Direct channels
Ts (cycles)
fADC=16 MHz(2)
2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V
0.25
Not allowed
Not allowed
0.7
Not allowed
4
0.5625
0.8
Not allowed
2.0
1.0
9
1
2.0
0.8
4.0
3.0
16
1.5
3.0
1.8
6.0
4.5
24
3
6.8
4.0
15.0
10.0
48
6
15.0
10.0
30.0
20.0
96
12
32.0
25.0
50.0
40.0
192
24
50.0
50.0
50.0
50.0
384
1. Guaranteed by design.
2. wNiuthmrbeesrpoefcst atomtphleesmcianlicmuulamtesdafmorplfiAnDgCti=m1e6TMs H(µzs.),For fADC = 8 and 4 MHz the number of sampling cycles can be reduced
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 12. The applicable
procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors
should be ceramic (good quality). They should be placed as close as possible to the chip.
102/136
DocID022799 Rev 13
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