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DSPIC33FJ16GS102-I/SO View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
DSPIC33FJ16GS102-I/SO
Microchip
Microchip Technology 
DSPIC33FJ16GS102-I/SO Datasheet PDF : 346 Pages
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dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
24.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 electrical characteristics.
Additional information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 family are listed below.
Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of
the device at these or any other conditions above the parameters indicated in the operation listings of this specification
is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V)
Voltage on any digital-only pin with respect to VSS .................................................................................. -0.3V to +5.6V
Voltage on VCAP/VDDCORE with respect to VSS ...................................................................................... 2.25V to 2.75V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin(2)...........................................................................................................................250 mA
Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA
Maximum output current sourced by any I/O pin(3)...................................................................................................4 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports(2)...............................................................................................................200 mA
Maximum output current sunk by non-remappable PWM pins ...............................................................................16 mA
Maximum output current sourced by non-remappable PWM pins ..........................................................................16 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 24-2).
3: Exceptions are PWMxL, and PWMxH, which are able to sink/source 16 mA, and digital pins, which are able
to sink/source 8 mA.
© 2009 Microchip Technology Inc.
Preliminary
DS70318D-page 283

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