DSPIC33FJ16GS102-I/SO View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

DSPIC33FJ16GS102-I/SO

High-Performance, 16-bit Digital Signal Controllers

Microchip Technology 

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04

24.1 DC Characteristics

TABLE 24-1: OPERATING MIPS VS. VOLTAGE

Characteristic

VDD Range

(in Volts)

Temp Range

(in °C)

3.0-3.6V

3.0-3.6V

-40°C to +85°C

-40°C to +125°C

Max MIPS

dsPIC33FJ06GS101/X02 and

dsPIC33FJ16GSX02/X04

40

40

TABLE 24-2: THERMAL OPERATING CONDITIONS

Rating

Industrial Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

Extended Temperature Devices

Operating Junction Temperature Range

Operating Ambient Temperature Range

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD – Σ IOH)

I/O Pin Power Dissipation:

I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation

Symbol Min

Typ

Max Unit

TJ

-40

—

+125

°C

TA

-40

—

+85

°C

TJ

-40

—

+140

°C

TA

-40

—

+125

°C

PD

PINT + PI/O

W

PDMAX

(TJ – TA)/θJA

W

TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol Typ Max Unit Notes

Package Thermal Resistance, 44-Pin QFN

θJA

28

—

°C/W

1

Package Thermal Resistance, 44-Pin TFQP

θJA

39

—

°C/W

1

Package Thermal Resistance, 28-Pin SPDIP

θJA

42

—

°C/W

1

Package Thermal Resistance, 28-Pin SOIC

θJA

47

—

°C/W

1

Package Thermal Resistance, 28-Pin QFN-S

θJA

34

—

°C/W

1

Package Thermal Resistance, 18-Pin SOIC

θJA

57

—

°C/W

1

Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.

DS70318D-page 284

Preliminary

© 2009 Microchip Technology Inc.

Share Link: