ST7LITEU05 ST7LITEU09
14 PACKAGE CHARACTERISTICS
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a Lead-free second level in-
terconnect. The category of second Level Inter-
connect is marked on the package and on the in-
ner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to solder-
ing conditions are also marked on the inner box la-
bel.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at: www.st.com.
14.1 PACKAGE MECHANICAL DATA
Figure 70. 8-Lead Very thin Fine pitch Dual Flat No-Lead Package
INDEX AREA
(D/2 x E/2)
A
D
E
TOP VIEW
SIDE VIEW
e
b
E2
mm
inches1)
Dim.
Min Typ Max Min Typ Max
A 0.80 0.90 1.00 0.031 0.035 0.039
A1 0.00 0.02 0.05 0.000 0.001 0.002
A3
0.20
0.008
b 0.25 0.30 0.35 0.010 0.012 0.014
D
4.50
0.177
D2 3.50 3.65 3.75 0.138 0.144 0.148
E
3.50
0.138
E2 1.96 2.11 2.21 0.077 0.083 0.087
e
0.80
0.031
L 0.30 0.40 0.50 0.012 0.016 0.020
Number of Pins
N
8
Note 1. Values in inches are converted from mm
and rounded to 3 decimal digits.
INDEX AREA
(D/2 x E/2)
L
D2
BOTTOM VIEW
101/115
1