ST72334J4TC View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST72334J4TC

8-bit MCU for automotive with single voltage Flash/ROM memory, ADC, 16-bit timers, SPI, SCI interfaces

STMicroelectronics 

ST72334xx-Auto, ST72314xx-Auto, ST72124Jx-Auto

EMC CHARACTERISTICS (Cont’d)

15.7.3 ESD Pin Protection Strategy

To protect an integrated circuit against Electrostat-

ic Discharge the stress must be controlled to pre-

vent degradation or destruction of the circuit ele-

ments. The stress generally affects the circuit ele-

ments which are connected to the pads but can

also affect the internal devices when the supply

pads receive the stress. The elements to be pro-

tected must not receive excessive current, voltage

or heating within their structure.

An ESD network combines the different input and

output ESD protections. This network works, by al-

lowing safe discharge paths for the pins subjected

to ESD stress. Two critical ESD stress cases are

presented in Figure 76 and Figure 77 for standard

pins and in Figure 78 and Figure 79 for true open

drain pins.

Standard Pin Protection

To protect the output structure the following ele-

ments are added:

– A diode to VDD (3a) and a diode from VSS (3b)

– A protection device between VDD and VSS (4)

To protect the input structure the following ele-

ments are added:

– A resistor in series with the pad (1)

– A diode to VDD (2a) and a diode from VSS (2b)

– A protection device between VDD and VSS (4)

Figure 76. Positive Stress on a Standard Pad vs. VSS

VDD

VDD

Main path

Path to avoid

(3a)

(2a)

(1)

OUT

(4)

IN

(3b)

(2b)

VSS

VSS

Figure 77. Negative Stress on a Standard Pad vs. VDD

VDD

VDD

Main path

(3a)

(2a)

(1)

OUT

(4)

IN

(3b)

(2b)

VSS

VSS

127/150

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