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ST72334J4TC View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
ST72334J4TC Datasheet PDF : 150 Pages
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ST72334xx-Auto, ST72314xx-Auto, ST72124Jx-Auto
EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to VDD are not implemented. An additional
local protection between the pad and VSS (5a and
5b) is implemented to completely absorb the posi-
tive ESD discharge.
Multisupply Configuration
When several types of ground (VSS, VSSA, ...) and
power supply (VDD, VDDA, ...) are available for any
reason (better noise immunity...), the structure
shown in Figure 80 is implemented to protect the
device against ESD.
Figure 78. Positive Stress on a True Open Drain Pad vs. VSS
VDD
VDD
Main path
Path to avoid
(1)
OUT
(4)
IN
(5a)
(3b)
(2b)
(5b)
VSS
Figure 79. Negative Stress on a True Open Drain Pad vs. VDD
VDD
Main path
OUT
(4)
IN
(3b)
(3b)
VSS
VDD
(1)
(2b)
(3b)
VSS
Figure 80. Multisupply Configuration
VDD
VSS
VDDA
VDDA
VSS
VSSA
BACK TO BACK DIODE
BETWEEN GROUNDS
VSSA
128/150

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