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STPS61170C_05 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STPS61170C_05
ST-Microelectronics
STMicroelectronics 
STPS61170C_05 Datasheet PDF : 5 Pages
1 2 3 4 5
Figure 11: TO-247 Package Mechanical Data
V
V
Dia
H
A
L5
L
L2
L4
F1
F2 L1
F3
V2
F4 L3
D
F(x3)
M
E
G
STPS61170C
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 4.85
5.15 0.191
0.203
D 2.20
2.60 0.086
0.102
E 0.40
0.80 0.015
0.031
F 1.00
1.40 0.039
0.055
F1
3.00
0.118
F2
2.00
0.078
F3 2.00
2.40 0.078
0.094
F4 3.00
3.40 0.118
0.133
G
10.90
0.429
H 15.45
15.75 0.608
0.620
L 19.85
20.15 0.781
0.793
L1 3.70
4.30 0.145
0.169
L2
18.50
0.728
L3 14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M 2.00
3.00 0.078
0.118
V
V2
60°
60°
Dia. 3.55
3.65 0.139
0.143
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 6: Ordering Information
Ordering type
Marking
STPS61170CW
STPS61170CW
Package
TO-247
Weight
4.40 g
Base qty
30
Delivery
mode
Tube
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 Nm.
Maximum torque value: 1.0 Nm.
Table 7: Revision History
Date
16-Sep-2005
Revision
1
First issue.
Description of Changes
4/5

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