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ST7PLIT115BF1M3 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
ST7PLIT115BF1M3 Datasheet PDF : 159 Pages
First Prev 141 142 143 144 145 146 147 148 149 150 Next Last
ST7LITE1xB
14 PACKAGE CHARACTERISTICS
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a Lead-free second level in-
terconnect. The category of second Level Inter-
connect is marked on the package and on the in-
ner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to solder-
ing conditions are also marked on the inner box la-
bel.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at: www.st.com.
14.1 PACKAGE MECHANICAL DATA
Figure 113. 16-Pin Plastic Dual In-Line Package, 300-mil Width
D1
b3
E
A2
A1
A
b2
D
b
e
L
c
E1
eB
mm
inches)
Dim.
Min Typ Max Min Typ Max
A
5.33
0.210
A1 0.38
0.015
A2 2.92 3.30 4.95 0.115 0.130 0.195
b 0.36 0.46 0.56 0.014 0.018 0.022
b2 1.14 1.52 1.78 0.045 0.060 0.070
b3 0.76 0.99 1.14 0.030 0.039 0.045
c 0.20 0.25 0.36 0.008 0.010 0.014
D 18.67 19.18 19.69 0.735 0.755 0.775
D1 0.13
0.005
e
2.54
0.100
E 7.62 7.87 8.26 0.300 0.310 0.325
E1 6.10 6.35 7.11 0.240 0.250 0.280
L 2.92 3.30 3.81 0.115 0.130 0.150
eB
10.92
0.430
Number of Pins
N
16
Note . Values in inches are converted from mm
and rounded to 3 decimal digits.
144/159

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