STD4NB40(1998) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STD4NB40 Datasheet PDF : 7 Pages
| |||
STD4NB40
THERMAL DATA
Rthj-ca se Thermal Resistance Junction-case
Max
2.5
Rthj-amb Thermal Resistance Junction-ambient
Max
100
Rthc- si nk Thermal Resistance Case-sink
Typ
1.5
Tl
Maximum Lead Temperature For Soldering Purpose
275
oC/ W
oC/W
oC/ W
oC
AVALANCHE CHARACTERISTICS
S ymb ol
IAR
E AS
Parameter
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, δ < 1%)
Single Pulse Avalanche Energy
(starting Tj = 25 oC, ID = IAR , VDD = 50 V)
Max Valu e
3.7
60
Unit
A
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
S ymb ol
V(BR)DSS
IDSS
IGSS
P a ra m et er
Test Conditions
Dr ain- sou rc e
Breakdown Voltage
ID = 250 µA VGS = 0
Zero G ate Voltage
VDS = Max Rating
Drain Current (VGS = 0) VDS = Max Rating
Tc = 125 oC
Gate-body Leakage
Current (VDS = 0)
VGS = ± 30 V
Min.
400
Typ. Max.
1
50
± 100
Unit
V
µA
µA
nA
ON (∗)
S ymb ol
V GS(th )
RDS( o n )
ID(o n)
P a ra m et er
Test Conditions
Gate Threshold
Voltage
VDS = VGS ID = 250 µA
Static Drain-source On VGS = 10V ID =2.3 A
Resistance
On St ate Drain Current VDS > ID(on) x RDS(on) max
VGS = 10 V
Min.
3
Typ .
4
Max.
5
Unit
V
1.47 1.8
Ω
4.7
A
DYNAMIC
S ymb ol
gfs (∗)
Ciss
Coss
Crss
P a ra m et er
Forward
Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS > ID(on) x RDS(on)max ID =2.3 A
Min.
1.5
Typ. Max.
2.4
Unit
S
VDS = 25 V f = 1 MHz VGS = 0
405 526 pF
72
94
pF
9
12
pF
2/6
Share Link: 