STPS0520M
Table 4: Thermal Resistance
Symbol
Rth(j-c) Junction to case
Rth(j-l)* Junction to ambient
Parameter
* Mounted with minimum recommended pad size, PC board FR4.
Value
20
250
Unit
°C/W
°C/W
Table 5: Static Electrical Characteristics
Symbol
Parameter
Tests conditions
Min. Typ Max.
Unit
t(s) IR *
Tj = 25°C
Tj = 100°C
Reverse leakage current
Tj = 25°C
VR = VRRM
VR = 10V
c Tj = 100°C
lete Produuct(s) VF * Forward voltage drop
Tj = 25°C
Tj = 100°C
Tj = 25°C
Tj = 100°C
IF = 0.5A
IF = 1A
15 50
µA
2
6
mA
7
25
µA
1
3
mA
0.35 0.385
0.26 0.30
V
0.38 0.415
0.30 0.338
so rod Pulse test:
* tp = 380 µs, δ < 2%
b P To evaluate the conduction losses use the following equation: P = 0.21 x IF(AV) + 0.175 IF2(RMS)
lete Prodduucctt((ss)) -- OObsolete Figure 1: Conduction losses versus average
so ro current
b P PF(AV)(W)
O te 0.22
0.20
δ = 0.05
δ = 0.1
δ = 0.2
le 0.18
o 0.16
bs 0.14
O0.12
δ = 0.5
δ=1
Figure 2: Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
0.55
0.50
0.45
0.40
0.35
0.30
Rth(j-a)=Rth(j-c)
Rth(j-a)=270°C/W
0.10
0.25
0.08
0.20
0.06
0.15
T
0.04
0.10
0.02
0.00
IF(AV)(A)
δ=tp/T
tp
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.05
0.00
0
Tamb(°C)
25
50
75
100
125
150
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