GS9075B View Datasheet(PDF) - Semtech Corporation

Part Name

Description

Manufacturer

GS9075B

HD-LINX® II Multi-Rate SDI Automatic Reclocker

Semtech Corporation 

6.2 Recommended PCB Footprint

0.50

0.25

0.55

8.70 7.10

CENTER PAD

NOTE: All dimensions

are in millimeters.

7.10

8.70

The center pad of the PCB footprint should be connected to the ground plane by a

minimum of 36 vias.

NOTE: Suggested dimensions only. Final dimensions should conform to customer

design rules and process optimizations.

6.3 Packaging Data

Parameter

Package Type

Moisture Sensitivity Level

Junction to Case Thermal Resistance, θj-c

Junction to Air Thermal Resistance, θj-a (at zero

airflow)

Psi, Ψ

Pb-free and RoHS Compliant

Value

9mm x 9mm 64-pin QFN

3

9.1°C/W

21.5°C/W

0.2°C/W

Yes

GS1575B / GS9075B HD-LINX® II Multi-Rate SDI

Automatic Reclocker

Data Sheet

40063 - 1

June 2009

26 of 28

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