6.4 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was performed
using the maximum Pb-free solder reflow profile shown in Figure 6-1. The
recommended standard Pb solder reflow profile is shown in Figure 6-2.
Temperature
260°C
250°C
217°C
200°C
3°C/sec max
60-150 sec.
20-40 sec.
6°C/sec max
150°C
25°C
60-180 sec. max
8 min. max
Time
Figure 6-1: Maximum Pb-free Solder Reflow Profile (Preferred)
Temperature
230°C
220°C
183°C
150°C
3°C/sec max
60-150 sec.
10-20 sec.
6°C/sec max
100°C
25°C
120 sec. max
6 min. max
Time
Figure 6-2: Standard Pb Solder Reflow Profile
GS1575B / GS9075B HD-LINX® II Multi-Rate SDI
Automatic Reclocker
Data Sheet
40063 - 1
June 2009
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