M24M01-RMN6P View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M24M01-RMN6P Datasheet PDF : 47 Pages
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Package information
M24M01-R M24M01-DF
9.3
WLCSP8 ultra thin package information
Figure 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale
package outline
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1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
Table 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale
mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.425
0.465
0.505
0.0167
0.0183
0.0199
A1
-
0.190
-
-
0.0075
-
A2
-
0.275
-
-
0.0108
-
b
-
0.270
-
-
0.0106
-
D
-
2.578
2.598
-
0.1015
0.1023
E
-
1.716
1.736
-
0.0676
0.0683
e
-
1.000
-
-
0.0394
-
e1
-
0.866
-
-
0.0341
-
e2
-
0.500
-
-
0.0197
-
e3
-
0.500
-
-
0.0197
-
F
-
0.425
-
-
0.0167
-
36/47
DocID12943 Rev 14
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