M24M01-RMN6P View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

M24M01-RMN6P

1-Mbit serial I²C bus EEPROM

STMicroelectronics 

M24M01-R M24M01-DF

Package information

Table 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale

mechanical data (continued)

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

G

-

0.789

-

aaa

-

0.11

-

bbb

-

0.11

-

ccc

-

0.11

-

ddd

-

0.06

-

eee

-

0.06

-

-

0.0311

-

-

0.0043

-

-

0.0043

-

-

0.0043

-

-

0.0024

-

-

0.0024

-

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 19. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale

recommended footprint







1. Dimensions are expressed in millimeters.



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