ADSP-BF518KSWZ-ENG View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADSP-BF518KSWZ-ENG

Blackfin Embedded Processor

Analog Devices 

Preliminary Technical Data

ADSP-BF512/BF514/BF516/BF518 (F)

A1 BALL

CORNER

12.10

12.00 SQ

11.90

TOP VIEW

10.40

BSC SQ

0.80

BSC

14 13 12 11 10 9 8 7 6 5 4 3 2 1

A1 BALL

CORNER

A

B

C

D

E

F

G

H

J

K

L

M

N

P

BOTTOM VIEW

DETAIL A

1.70

1.60

1.45

0.70

0.56

SEATING

PLANE

DETAIL A

1.36

1.26

1.16

0.34 NOM

0.29 MIN

0.50

COPLANARITY

0.45

0.20

0.40

BALL DIAMETER

COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.

Figure 59. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-168-1)

Dimensions shown in millimeters

SURFACE MOUNT DESIGN

Table 50 is provided as an aide to PCB design. For industry-

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

Table 50. BGA Data for Use with Surface-Mount Design

Package

168-Ball CSP_BGA

Ball Attach Type

Solder Mask Defined

Solder Mask Opening

TBD mm diameter

Ball Pad Size

TBD mm diameter

Rev. PrE | Page 61 of 62 | March 2009

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