ADSP-BF526BBCZ-4AX View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADSP-BF526BBCZ-4AX

Blackfin® Embedded Processor

Analog Devices 

Preliminary Technical Data

ADSP-BF522/523/524/525/526/527

A1 BALL

CORNER

*1.75

1.61

1.46

17.10

17.00 SQ

16.90

TOP VIEW

DETAIL A

15.20

BSC SQ

0.80

BSC

A1 CORNER

INDEX AREA

20 18 16 14 12 10 8 6 4 2

19 17 15 13 11 9 7 5 3 1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

V

W

Y

BOTTOM VIEW

DETAIL A

1.36

1.26

1.16

0.35 NOM

0.30 MIN

SEATING

PLANE

*0.50

0.45

0.40

BALL

DIAMETER

*COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH

EXCEPTION TO PACKAGE HEIGHT AND BALL DIAMETER.

COPLANARITY

0.12

Figure 77. 208-Ball CSP_BGA (BC-208-2)

SURFACE MOUNT DESIGN

Table 63 is provided as an aide to PCB design. For industry-

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

Table 63. Surface Mount Design Supplement

Package

289-Ball CSP_BGA

208-Ball CSP_BGA

Ball Attach Type

Solder Mask Defined

Solder Mask Defined

Solder Mask Opening

0.26 mm diameter

0.40 mm diameter

Ball Pad Size

0.35 mm diameter

0.50 mm diameter

Rev. PrG | Page 79 of 80 | February 2009

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