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STM32WB55CCU7ATR View Datasheet(PDF) - STMicroelectronics

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Description
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STM32WB55CCU7ATR Datasheet PDF : 193 Pages
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Electrical characteristics
STM32WB55xx STM32WB35xx
Table 58. Low-speed external user clock characteristics(1) – Bypass mode
Symbol
Parameter
Conditions
Min
Typ
Max Unit
VLSEH
VLSEL
OSC32_IN input pin
high level voltage
OSC32_IN input pin
low level voltage
-
0.7 VDDx
-
VDDx
V
-
VSS
-
0.3 VDDx
tw(LSEH) OSC32_IN high or
tw(LSEL) low time
-
250
-
-
ns
Includes initial
ftolLSE
Frequency tolerance
accuracy, stability over
temperature, aging and
-500
-
+500 ppm
frequency pulling
1. Guaranteed by design.
6.3.11
Internal clock source characteristics
The parameters given in Table 59 are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 24: General operating
conditions. The provided curves are characterization results, not tested in production.
High-speed internal (HSI16) RC oscillator
Table 59. HSI16 oscillator characteristics(1)
Symbol
Parameter
Conditions
Min Typ Max Unit
fHSI16
HSI16 Frequency
VDD=3.0 V, TA=30 °C 15.88
-
16.08 MHz
TRIM
HSI16 user trimming step
Trimming code is not a
multiple of 64
0.2
0.3
0.4
Trimming code is a
multiple of 64
-4
-6
-8
DuCy(HSI16)(2) Duty Cycle
-
∆Temp(HSI16)
HSI16 oscillator frequency drift over TA= 0 to 85 °C
temperature
TA= -40 to 125 °C
45
-
55
%
-1
-
1
-2
-
1.5
∆VDD(HSI16)
tsu(HSI16)(2)
tstab(HSI16)(2)
IDD(HSI16)(2)
HSI16 oscillator frequency drift over
VDD
HSI16 oscillator start-up time
VDD=1.62 V to 3.6 V
-
HSI16 oscillator stabilization time
-
HSI16 oscillator power consumption
-
-0.1
-
0.05
-
0.8 1.2
μs
-
3
5
-
155 190 μA
1. Guaranteed by characterization results.
2. Guaranteed by design.
122/193
DS11929 Rev 10

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