STM32WB55CCU6ATR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32WB55CCU6ATR

Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

STMicroelectronics 

Package information

7

Package information

STM32WB55xx STM32WB35xx

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

7.1

UFBGA129 package information

This UFBGA is a 129-ball, 7 x 7 mm, 0.5 mm fine pitch, square ball grid array package.

Figure 38. UFBGA129 package outline

A1 corner index area

A4

B

A2

SEATING

PLANE

A B C D E F G HJ K L M N

b

1

2

3

4

5

6

7

8

9

10

11

b (129 balls)

12

eee M C A B 13

e

E1 E

fff M C

e

F

F

A1

D1

D

BOTTOM VIEW

A

ddd C

B09R_UFBGA129_ME_V2

1. Drawing is not to scale.

2. - The terminal A1 corner must be identified on the top surface by using a corner chamfer,

ink or metalized markings, or other feature of package body or integral heat slug.

- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1

corner. Exact shape of each corner is optional.

Symbol

A(2)

A1

A2

A4

b(3)

Table 100. UFBGA129 mechanical data

millimeters

inches(1)

Min

Typ

Max

Min

Typ

-

-

0.60

-

-

-

-

0.11

-

-

-

0.13

-

-

0.005

-

0.32

-

-

0.013

0.24

0.29

0.34

0.009

0.011

Max

0.024

0.004

-

-

0.013

170/193

DS11929 Rev 10

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