STPCE1EDBI データシートの表示（PDF） - STMicroelectronics

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STPCE1EDBI

X86 Core General Purpose PC Compatible System - on - Chip

STMicroelectronics 

MECHANICAL DATA

5.2. 388-PIN PACKAGE THERMAL DATA

The structure in shown in Figure 5-4.

The 388-pin PBGA package has a Power

Dissipation Capability of 4.5W. This increases to

6W when used with a Heatsink.

Thermal dissipation options are illustrated in

Figure 5-5 and Figure 5-6.

Figure 5-4. 388-Pin PBGA structure

Signal layers

Power & Ground layers

Thermal balls

Figure 5-5. Thermal Dissipation Without Heatsink

Board

Ambient

Case

Junction

Board

Ambient

Junction

Board dimensions:

- 10.2 cm x 12.7 cm

Rca

- 4 layers (2 for signals, 1 GND, 1VCC)

6

6

The PBGA is centred on board

Rjc

Board

8.5

Rjb

Case

125

There are no other devices

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Copper thickness:

Ambient

- 17µm for internal layers

Rba

- 34µm for external layers

Rja = 13 °C/W

Airflow = 0

Board temperature taken at the centrecentre ba

56/87

Release 1.3 - January 29, 2002

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