STPCE1EDBI データシートの表示（PDF） - STMicroelectronics

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STPCE1EDBI

X86 Core General Purpose PC Compatible System - on - Chip

STMicroelectronics 

MECHANICAL DATA

5.3. SOLDERING RECOMMENDATIONS

High quality, low defect soldering requires

identifying the optimum temperature profile for

reflowing the solder paste, therefore optimizing

the process. The heating and cooling rise rates

must be compatible with the solder paste and

components. A typical profile consists of a

preheat, dryout, reflow and cooling sections.

Dryout section is used primarily to ensure that

the solder paste is fully dried before hitting reflow

temperatures.

Solder reflow is accomplished in the reflow zone,

where the solder paste is elevated to a

temperature greater than the melting point of the

solder. Melting temperature must be exceeded by

approximately 20°C to ensure quality reflow.

The most critical parameter in the preheat

section is to minimize the rate of temperature rise

to less than 2°C / second, in order to minimize

thermal shock on the semi-conductor

components.

In reality the profile is not a line, but rather a range

of temperatures all solder joints must be

exposed. The total temperature deviation from

component thermal mismatch, oven loading and

oven uniformity must be within the band.

Figure 5-7. Reflow soldering temperature range

Temperature ( °C )

250

200

150

100

50

PREHEAT

0

0

DRYOUT

REFLOW

240

COOLING

Time ( s )

58/87

Release 1.3 - January 29, 2002

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