PIC16LC925T-I/CL 查看數據表（PDF） - Microchip Technology
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PIC16LC925T-I/CL Datasheet PDF : 182 Pages
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PIC16C925/926
15.1 DC Characteristics (Continued)
PIC16LC925/926
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
0°C ≤ TA ≤ +70°C for commercial
PIC16C925/926
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
0°C ≤ TA ≤ +70°C for commercial
Param
No.
Sym
Characteristic
Min Typ† Max Units
Conditions
IPD
Power-down Current (Note 3)
D020
PIC16LC925/926 — 0.9 5 µA VDD = 3.0V
D020
PIC16C925/926 — 1.5 21 µA VDD = 4.0V
Module Differential Current (Note 5)
D021 ∆IWDT
Watchdog Timer — 6.0 20 µA VDD = 3.0V
PIC16LC925/926
D021
Watchdog Timer — 9.0 25 µA VDD = 4.0V
PIC16C925/926
D022
∆ILCDT1
LCD Voltage —
Generation with
internal RC osc enabled
PIC16LC925/926
36 50 µA VDD = 3.0V (Note 7)
D022
LCD Voltage —
Generation with
internal RC osc enabled
PIC16C925/926
40 55 µA VDD = 4.0V (Note 7)
D022A ∆IBOR
Brown-out Reset — 100 150 µA BODEN bit set, VDD = 5.0
D024 ∆ILCDT1
LCD Voltage —
Generation with
Timer1 @ 32.768 kHz
PIC16LC925/926
15 29 µA VDD = 3.0V (Note 7)
D024
LCD Voltage —
Generation with
Timer1 @ 32.768 kHz
PIC16C925/926
33 60 µA VDD = 4.0V (Note 7)
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin load-
ing and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on
the current consumption.The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail;
all I/O pins tri-stated, pulled to VDD
MCLR = VDD.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
6: PWRT must be enabled for slow ramps.
7: ∆ΙLCDT1 and ∆ΙLCDRC includes the current consumed by the LCD Module and the voltage generation
circuitry. This does not include current dissipated by the LCD panel.
DS39544A-page 142
Preliminary
2001 Microchip Technology Inc.
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