STM32F103T8U7TR 查看數據表（PDF） - STMicroelectronics

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STM32F103T8U7TR

Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces

STMicroelectronics 

Electrical characteristics

STM32F103xC, STM32F103xD, STM32F103xE

Table 9. Thermal characteristics

Symbol

Ratings

TSTG

TJ

Storage temperature range

Maximum junction temperature

Value

Unit

–65 to +150

°C

150

°C

5.3

5.3.1

Operating conditions

General operating conditions

Table 10. General operating conditions

Symbol

Parameter

Conditions

Min Max Unit

fHCLK Internal AHB clock frequency

0

72

fPCLK1 Internal APB1 clock frequency

0

36 MHz

fPCLK2 Internal APB2 clock frequency

0

72

VDD

Standard operating voltage

2

3.6

V

VDDA(1)

Analog operating voltage

(ADC not used)

Analog operating voltage

(ADC used)

2

3.6

Must be the same potential

as VDD(2)

2.4 3.6

V

VBAT Backup operating voltage

LQFP144

1.8 3.6

V

666

Power dissipation at TA =

PD

85 °C for suffix 6 or TA =

105 °C for suffix 7(3)

LQFP100

LQFP64

LFBGA100

434

444 mW

500

LFBGA144

500

Ambient temperature for 6

suffix version

Maximum power dissipation –40 85

Low power dissipation(4)

–40 105

°C

TA

Ambient temperature for 7

suffix version

Maximum power dissipation –40 105

Low power dissipation(4)

–40 125

°C

6 suffix version

TJ

Junction temperature range

7 suffix version

–40 105

°C

–40 125

1. When the ADC is used, refer to Table 58: ADC characteristics.

2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV

between VDD and VDDA can be tolerated during power-up and operation.

3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal

characteristics on page 114).

4. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Table 6.2: Thermal characteristics on page 114).

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