E28F640J3C-150 查看數據表（PDF） - Intel

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E28F640J3C-150

Intel StrataFlash® Memory (J3)

Intel 

256-Mbit J3 (x8/x16)

3.2

Easy BGA (J3) Package

Figure 4. Intel StrataFlash® Memory (J3) Easy BGA Mechanical Specifications

Ball A1

Corner

D

Ball A1

Corner

S1

12 3 4 5 6 7 8

A

B

C

D

E

E

F

G

H

Top View - Ball side down

8 7 6 5 4 3 21

A

B

C

D

E

F

G

H

Bottom View - Ball Side Up

S2

b

e

A1

A2

A

Seating

Plane

Y

Note: Drawing not to scale

Table 2. Easy BGA Package Dimensions

Millimeters

Inches

Symbol Min

Package Height

A

Ball Height

A1

Package Body Thickness

A2

Ball (Lead) Width

b

Package Body Width (32 Mb, 64 Mb, 128 Mb, 256 Mb) D

Package Body Length (32 Mb, 64 Mb, 128 Mb)

E

Package Body Length (256 Mb)

E

Pitch

[e]

Ball (Lead) Count

N

Seating Plane Coplanarity

Y

Corner to Ball A1 Distance Along D (32/64/128/256 Mb) S1

Corner to Ball A1 Distance Along E (32/64/128 Mb)

S2

Corner to Ball A1 Distance Along E (256 Mb)

S2

0.250

0.330

9.900

12.900

14.900

1.400

2.900

3.900

Nom

0.780

0.430

10.000

13.000

15.000

1.000

64

1.500

3.000

4.000

Max

1.200

0.530

10.100

13.100

15.100

0.100

1.600

3.100

4.100

Notes Min

0.0098

0.0130

1

0.3898

1

0.5079

1

0.5866

1

0.0551

1

0.1142

1

0.1535

Nom

0.0307

0.0169

0.3937

0.5118

0.5906

0.0394

64

0.0591

0.1181

0.1575

Max

0.0472

0.0209

0.3976

0.5157

0.5945

0.0039

0.0630

0.1220

0.1614

NOTES:

1. For Daisy Chain Evaluation Unit information refer to the Intel Flash Memory Packaging Technology Web page at;

www.intel.com/design/packtech/index.htm

2. For Packaging Shipping Media information see www.intel.com/design/packtech/index.htm

12

Datasheet

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