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B0530W 查看數據表(PDF) - Linear Technology

零件编号
产品描述 (功能)
生产厂家
B0530W
Linear
Linear Technology 
B0530W Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
PACKAGE DESCRIPTION
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BA
LT3474/LT3474-1
2.74
(.108)
4.90 – 5.10*
(.193 – .201)
2.74
(.108)
16 1514 13 12 1110 9
6.60 ±0.10
4.50 ±0.10
SEE NOTE 4
2.74
(.108)
0.45 ±0.05
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
2.74 6.40
(.108)
(.252)
BSC
12345678
1.10
(.0433)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE16 (BA) TSSOP 0204
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3474fd
19

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