M24M01-RMN6G 查看數據表（PDF） - STMicroelectronics

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M24M01-RMN6G

1 Mbit serial I²C bus EEPROM

STMicroelectronics 

M24M01-R, M24M01-W, M24M01-HR

Package mechanical data

Figure 16. WLCSP8 – Wafer level chip scale package outline

e1

D

e2

E

aaa

(4X)

Orientation reference

Wafer’s back side

Bump

Detail A

Orientation

reference

A2

A

Side view

F

Bump side

e

e2

G

A1

eee Z

b(8X)(2)

Z

Note 4

Seating plane(3)

Detail A rotated by 90°

E1_ME

1. Drawing is not to scale and corresponds to preliminary data.

2. The dimension is measured at the maximum bump diameter parallel to primary datum Z.

3. The primary datum Z and seating plane are defined by the spherical crowns of the bump.

4. Bump position designation per JESD 95-1, SPP-010.

Table 17. WLCSP8 – Wafer level chip scale package mechanical data(1)

Symbol

millimeters

Typ

Min

Max

inches(2)

Typ

Min

Max

A

0.580

A1

0.230

A2

0.350

b

0.322

D

3.570

E

2.050

e

0.600

e1

2.400

e2

1.200

F

0.585

G

0.424

aaa

0.110

bbb

0.110

ccc

0.110

ddd

0.060

eee

0.060

N (number of bumps) 8

0.555

0.605

3.685

2.165

0.0228

0.0091

0.0138

0.0127

0.1406

0.0807

0.0236

0.0945

0.0472

0.0230

0.0167

0.0043

0.0043

0.0043

0.0024

0.0024

0.0219

0.0238

0.1451

0.0852

1. Preliminary data.

2. Values in inches are converted from mm and rounded to 4 decimal digits.

Doc ID 12943 Rev 7

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