M24M01-RMN6G 查看數據表（PDF） - STMicroelectronics

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M24M01-RMN6G

1 Mbit serial I²C bus EEPROM

STMicroelectronics 

M24M01-R die description

8

M24M01-R die description

M24M01-R, M24M01-W, M24M01-HR

Caution:

As EEPROM cells loose their charge (and so their binary value) when exposed to ultra violet

(UV) light, EEPROM dice delivered in wafer form by STMicroelectronics must never be

exposed to UV light.

Product M24M01-A

● Wafer size

● Die identification

Die Layout

● Die size (X × Y)

● Scribe line

● Pad opening

● DI

● Pads

203 mm (8 inches)

M24M01, processed in the Rousset fab

2085 × 3605 µm (including scribe line)

80.0 × 80.0 µm

90 × 90 µm

Die identification (at the position shown in Figure 17)

Pad contacts (at the positions shown in Figure 17 and

Table 18)

Figure 17. M24M01-R die plot

E0

E1

VCC

WC

Y

X

E2

VSS

Die identification: M24M01

1. Refer to Table 18: Pad coordinates for the pad locations.

SCL

SDA

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Doc ID 12943 Rev 7

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