PIC16LC773I/SO 查看數據表（PDF） - Microchip Technology
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PIC16LC773I/SO Datasheet PDF : 202 Pages
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PIC16C77X
17.4 K04-052 28-Lead Plastic Small Outline (SO) – Wide, 300 mil
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
E
p
D
B
n
X
45 °
c
R1
2
1
L
R2
A
L1
A2
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
Pitch
p
MIN
NOM
MAX
MIN
NOM
MAX
0.050
1.27
Number of Pins
n
Overall Pack. Height
A
28
28
0.093
0.099
0.104
2.36
2.50
2.64
Shoulder Height
A1
0.048
0.058
0.068
1.22
1.47
1.73
Standoff
A2
Molded Package Length D‡
Molded Package Width
E‡
0.004
0.700
0.292
0.008
0.706
0.296
0.011
0.712
0.299
0.10
17.78
7.42
0.19
17.93
7.51
0.28
18.08
7.59
Outside Dimension
E1
Chamfer Distance
X
Shoulder Radius
R1
0.394
0.010
0.005
0.407
0.020
0.005
0.419
0.029
0.010
10.01
0.25
0.13
10.33
0.50
0.13
10.64
0.74
0.25
Gull Wing Radius
R2
0.005
0.005
0.010
0.13
0.13
0.25
Foot Length
Foot Angle
L
0.011
0.016
0.021
0.28
0.41
0.53
0
4
8
0
4
8
Radius Centerline
L1
Lead Thickness
c
Lower Lead Width
B†
Mold Draft Angle Top
Mold Draft Angle Bottom
0.010
0.009
0.014
0
0
0.015
0.011
0.017
12
12
0.020
0.012
0.019
15
15
0.25
0.23
0.36
0
0
0.38
0.27
0.42
12
12
0.51
0.30
0.48
15
15
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
1999-2013 Microchip Technology Inc.
Advance Information
DS30275B-page 179
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