PIC16LC773I/SO 查看數據表（PDF） - Microchip Technology
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PIC16LC773I/SO Datasheet PDF : 202 Pages
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PIC16C77X
17.6 K04-016 40-Lead Plastic Dual In-line (P) – 600 mil
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
D
2
n
1
E1
A1
R
eB
A
c
A2
L
B1
B
p
Units
Dimension Limits
PCB Row Spacing
Number of Pins
n
Pitch
p
Lower Lead Width
B
Upper Lead Width
B1†
Shoulder Radius
R
Lead Thickness
c
Top to Seating Plane
A
Top of Lead to Seating Plane A1
Base to Seating Plane
A2
Tip to Seating Plane
L
Package Length
D‡
Molded Package Width
E‡
Radius to Radius Width
E1
Overall Row Spacing
eB
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
0.016
0.045
0.000
0.009
0.110
0.073
0.020
0.125
2.013
0.530
0.545
0.630
5
5
INCHES*
NOM
0.600
40
0.100
0.018
0.050
0.005
0.010
0.160
0.093
0.020
0.130
2.018
0.535
0.565
0.610
10
10
MAX
0.020
0.055
0.010
0.011
0.160
0.113
0.040
0.135
2.023
0.540
0.585
0.670
15
15
MILLIMETERS
MIN
NOM
15.24
40
2.54
0.41
0.46
1.14
1.27
0.00
0.13
0.23
0.25
2.79
4.06
1.85
2.36
0.51
0.51
3.18
3.30
51.13
51.26
13.46
13.59
13.84
14.35
16.00
15.49
5
10
5
10
MAX
0.51
1.40
0.25
0.28
4.06
2.87
1.02
3.43
51.38
13.72
14.86
17.02
15
15
* Controlling Parameter.
† Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
1999-2013 Microchip Technology Inc.
Advance Information
DS30275B-page 181
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