PIC16LC773I/SO 查看數據表（PDF） - Microchip Technology
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PIC16LC773I/SO Datasheet PDF : 202 Pages
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PIC16C77X
17.7 K04-014 40-Lead Ceramic Dual In-line with Window (JW) – 600 mil
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
W
D
2
n
1
E1
A
R
c
eB
A2
Units
Dimension Limits
PCB Row Spacing
Number of Pins
n
Pitch
p
Lower Lead Width
B
Upper Lead Width
B1
Shoulder Radius
R
Lead Thickness
c
Top to Seating Plane
A
Top of Lead to Seating Plane A1
Base to Seating Plane
A2
Tip to Seating Plane
L
Package Length
D
Package Width
E
Radius to Radius Width
E1
Overall Row Spacing
eB
Window Diameter
W
* Controlling Parameter.
A1
L
B1
B
p
MIN
0.098
0.016
0.050
0.000
0.008
0.190
0.117
0.030
0.135
2.040
0.514
0.560
0.610
0.340
INCHES*
NOM
0.600
40
0.100
0.020
0.053
0.005
0.011
0.205
0.135
0.045
0.140
2.050
0.520
0.580
0.660
0.350
MAX
0.102
0.023
0.055
0.010
0.014
0.220
0.153
0.060
0.145
2.060
0.526
0.600
0.710
0.360
MILLIMETERS
MIN
NOM
MAX
15.24
40
2.49
2.54
2.59
0.41
0.50
0.58
1.27
1.33
1.40
0.00
0.13
0.25
0.20
0.28
0.36
4.83
5.21
5.59
2.97
3.43
3.89
0.00
1.14
1.52
3.43
3.56
3.68
51.82
52.07
52.32
13.06
13.21
13.36
14.22
14.73
15.24
15.49
16.76
18.03
8.64
8.89
9.14
DS30275B-page 182
Advance Information
1999-2013 Microchip Technology Inc.
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