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STPS1L30MF 查看數據表(PDF) - STMicroelectronics

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STPS1L30MF Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Characteristics
1
Characteristics
STPS1L30MF
Table 2. Thermal resistance
Symbol
Parameter
Value
Unit
Rth(j-c)
Rth(j-a)(1)
Junction to case
Junction to ambient
1. Mounted with minimum recommended pad size, PC board FR4
20
°C/W
250
°C/W
Table 3. Static electrical characteristics
Symbol
Parameter
Tests conditions
Min. Typ Max. Unit
Tj = 25° C
Tj = 85° C
VR = VRRM
0.13 0.39
5.25 16.5
IR (1)
Tj = 25° C
Reverse leakage current
Tj = 85° C
VR = 20 V
0.05 0.24
mA
3.5 10.5
Tj = 25° C
Tj = 85° C
VR = 10 V
0.03 0.15
2.4
7
Tj = 25° C
Tj = 85° C
IF = 1 A
0.33 0.39
0.28 0.34
VF (1) Forward voltage drop
Tj = 25° C
Tj = 85° C
Tj = 25° C
Tj = 85° C
IF = 2 A
IF = 3 A
0.39 0.45
0.36 0.42
V
0.45 0.53
0.43 0.51
Tj = 25° C
Tj = 85° C
IF = 4 A
0.50 0.60
0.50 0.60
1. Pulse test: = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.26 x IF(AV) + 0.08 IF2(RMS)
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