1.3
Package Dimensions
Top View
A
D
Laser Mark for Pin 1
Identification in This Area
18
17
Bottom View
D2
1
L
68
0.30
0.30
b
e
27, 2013 aaa C A
mber aaa C B
bbb C
A
A2
ccc C
A3
A1
0.10
riday, Septe E
oint.com.cn - F B
excelp eee C A B
u - 1.30
o 34
.zh 35
Seating
Plane
Side View
gbo keven E2
d for qin eee C A B
re 51 1.30
Prepa 52 L
Description
A
A1
A2
A3
b
D
D2
e
Notes
Min
Typ
Max Description
Min
Typ
Max
0.80 0.85 0.90 E
7.90 8.00 8.10
0.00 0.035 0.05 E2
4.50 4.60 4.70
-
0.65 0.67 L
0.35 0.40 0.45
-
0.203
-
aaa
-
0.10
-
0.15 0.20 0.25 bbb
-
0.10
-
7.90 8.00 8.10 ccc
-
0.08
-
4.50 4.60 4.70 ddd
-
0.10
-
-
0.40
-
eee
-
0.10
-
1. Dimensions and tolerances conform to ASME Y14.5M. - 1994
2. Pin 1 identifier is placed on top surfaceof the package by using identation
mark or other feature of package body.
3. Exact shape and size of this feature is optional.
4. Package warpage 0.08mm maximum.
Description
Size
QFN
8 x 8 x 0.9mm
JEDEC
MO-220
Pin 1 ID
ddd M C A B
Pitch
0.4mm pitch
Units
mm
Production Information
© Cambridge Silicon Radio Limited 2013
Confidential Information - This Material is Subject to CSR's Non-disclosure Agreement
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