1.4 PCB Design and Assembly Considerations
This section lists recommendations to achieve maximum board-level reliability of the 8 x 8 x 0.9mm QFN 68-lead
package:
■ NSMD lands (lands smaller than the solder mask aperture) are preferred, because of the greater accuracy of
the metal definition process compared to the solder mask process. With solder mask defined pads, the overlap
of the solder mask on the land creates a step in the solder at the land interface, which can cause stress
concentration and act as a point for crack initiation.
■ CSR recommends that the PCB land pattern is in accordance with IPC standard IPC-7351.
■ Solder paste must be used during the assembly process.
1.5 Typical Solder Reflow Profile
For
information,
see Typical Solder Reflow Profile for Lead-free Devices
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Information Note.
- Friday, September
27,
2013
Production Information
© Cambridge Silicon Radio Limited 2013
Confidential Information - This Material is Subject to CSR's Non-disclosure Agreement
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