STM32F100xC, STM32F100xD, STM32F100xE
Electrical characteristics
Table 13. Maximum current consumption in Run mode, code with data processing
running from Flash
Symbol Parameter
Conditions
fHCLK
Max(1)
TA = 85 °C TA = 105 °C
Unit
24 MHz
19.7
20
External clock (2), all
peripherals enabled
16 MHz
14.6
14.7
8 MHz
8.2
8.6
24 MHz
11.3
External clock(2), all
peripherals disabled
16 MHz
8.7
Supply
8 MHz
5.6
IDD
current in
Run mode
24 MHz
19
HSI clock(2), all peripherals
enabled
16 MHz
13.1
8 MHz
10.1
11.6
8.9
6
mA
19
13.2
10.1
24 MHz
9.4
9.6
HSI clock(2), all peripherals
disabled
16 MHz
6.7
7
8 MHz
5.4
5.6
1. Based on characterization, not tested in production.
2. External clock or HSI frequency is 8 MHz and PLL is on when fHCLK > 8 MHz.
Table 14.
Symbol
Maximum current consumption in Run mode, code with data processing
running from RAM
Parameter
Conditions
fHCLK
Max(1)
TA = 85 °C TA = 105 °C
Unit
24 MHz
18.5
19
External clock (2), all
peripherals enabled
16 MHz
13.1
13.5
8 MHz
7.3
7.6
24 MHz
8.4
External clock(2) all
peripherals disabled
16 MHz
7.3
IDD
Supply current
in Run mode
8 MHz
4.8
24 MHz
17.2
HSI clock(2), all
peripherals enabled
16 MHz
11.7
8 MHz
8.9
8.5
7.7
5.2
mA
17.2
11.8
9
24 MHz
8.1
8.3
HSI clock(2), all
peripherals disabled
16 MHz
5.6
5.8
8 MHz
4.3
4.5
1. Based on characterization, tested in production at VDD max, fHCLK max.
2. External clock or HSI frequency is 8 MHz and PLL is on when fHCLK > 8 MHz.
Doc ID 15081 Rev 7
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