STM32F301R8T7 查看數據表（PDF） - STMicroelectronics

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STM32F301R8T7

ARM® Cortex®-M4 32-bit MCU+FPU, up to 64 KB Flash, 16 KB SRAM, ADC, DAC, COMP, Op-Amp, 2.0 – 3.6 V

STMicroelectronics 

STM32F301x6 STM32F301x8

Electrical characteristics

6.3

6.3.1

Operating conditions

General operating conditions

Table 23. General operating conditions

Symbol

Parameter

Conditions

Min

Max Unit

fHCLK

fPCLK1

fPCLK2

VDD

VDDA

VBAT

VIN

PD

TA

TJ

Internal AHB clock frequency

-

Internal APB1 clock frequency

-

Internal APB2 clock frequency

-

Standard operating voltage

-

Analog operating voltage

(OPAMP and DAC not used)

Analog operating voltage

(OPAMP and DAC used)

Must have a potential

equal to or higher than

VDD

Backup operating voltage

-

TC I/O

TT I/O(1)

I/O input voltage

TTa I/O pins

FT and FTf I/O(1)

BOOT0

Power dissipation at

TA

TA

=

=

85 °C for suffix 6 or

105 °C for suffix 7(2)

LQFP64

LQFP48

WLCSP49

UFQFPN32

Ambient temperature for 6

suffix version

Maximum power

dissipation

Low power dissipation(3)

Ambient temperature for 7

suffix version

Maximum power

dissipation

Low power dissipation(3)

Junction temperature range

6 suffix version

7 suffix version

0

72

0

36

MHz

0

72

2

3.6

V

2

3.6

V

2.4

3.6

1.65

3.6

V

–0.3 VDD+0.3

-0.3

3.6

–0.3 VDDA+0.3 V

–0.3

5.5

0

5.5

-

444

-

364

mW

-

408

-

540

–40

85

°C

–40

105

–40

105

°C

–40

125

–40

105

°C

–40

125

1. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

2. tIhf eTrAmisallocwhaerr,ahctigehriestricPsD. values are allowed as long as TJ does not exceed TJmax. See Table 80: Package

3.

In low

Table

8p0o:wPearcdkiassgiepathtieornmsatal tceh,aTrAacctaenrisbteicsextended

to

this

range

as

long

as

TJ

does

not

exceed

TJmax.

See

DocID025146 Rev 6

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