STPCI2 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STPCI2

X86 CORE PC COMPATIBLE SYSTEM-ON-CHIP FOR TERMINALS

STMicroelectronics 

STPC® ATLAS

5.2. 516-PIN PACKAGE THERMAL DATA

516-pin PBGA package has a Power Dissipation

Capability of 4.5W which increases to 6W when

used with a Heatsink.

Figure 5-4. 516-Pin PBGA Structure

The structure in shown in Figure 5-4.

Thermal dissipation options are illustrated in

Figure 5-5 and Figure 5-6.

Signal layers

Power & Ground layers

Thermal balls

t(s) Figure 5-5. Thermal Dissipation Without Heatsink

Obsolete Produc Board

uct(s) - Ambient

rod Case

te P Junction

oleBoard

Obs Ambient

Junction

Board dimensions:

- 10.2 cm x 12.7 cm

Rca

- 4 layers (2 for signals, 1 GND, 1VCC)

6

6

The PBGA is centred on board

Rjc

Board

Case There are no other devices

Rjb

8.5

125

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Copper thickness:

Rba

Ambient

- 17µm for internal layers

- 34µm for external layers

Airflow = 0

Rja = 13 °C/W

Board temperature taken at the centre balls

70/108

1

Share Link: