Maximum ratings
5
Maximum ratings
M41T00CAP
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 4. Absolute maximum ratings
Sym
Parameter
Value
Unit
TSTG Storage temperature (VCC off, oscillator off)
–55 to 125
°C
VCC Supply voltage
–0.3 to 7
V
TSLD(1)(2) Lead solder temperature for 10 seconds
260
°C
VIO Input or output voltages
–0.3 to VCC +0.3
V
IO
Output current
20
mA
PD
Power dissipation
1
W
1. Soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds. In order to protect the lithium
battery, preheat temperatures must be limited such that the battery temperature does not exceed +85 °C.
Furthermore, the devices shall not be exposed to IR reflow.
2. For DIP packaged devices, ultrasonic vibrations should not be used for post-solder cleaning to avoid
damaging the crystal.
Caution: Negative undershoots below –0.3 volts are not allowed on any pin while in the battery
backup mode.
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Doc ID 14557 Rev 5